Labels Milestones
BackWLCSP-115, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 0.704x1.054mm, 6 Ball, 2x3.
- (sw14 // 1 for manual.
- High-Speed Hermaphroditic Terminal/Socket Strip, LSHM-130-xx.x-x-DV-S, 30 Pins per.
- 236-414 45Degree pitch 5mm size.
- = (board_width - hole_hdist) .