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BackSwitch for High-Density Packaging with Ground Terminal Middle Stroke Tactile Switch with High Contact Reliability, Side-actuated Model, with Ground Terminal, without Boss Ultra-small-sized Tactile Switch with High Contact Reliability, Side-actuated Model, without Ground Terminal, with Boss Ultra-small-sized Tactile Switch with High Contact Reliability, Side-actuated Model, with Ground Terminal Middle Stroke Tactile Switch with High Contact Reliability, Side-actuated Model, with Ground Terminal Middle Stroke Tactile Switch SPST Slide 8.61mm 338mil SMD LowProfile JPin SMD 3x-dip-switch SPST , Piano, row spacing 15.24 mm (600 mils), Socket, LongPads 42-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket LongPads 24-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 22.86 mm (900 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 1x-dip-switch SPST , Slide, row spacing 6.73 mm (264 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 2x-dip-switch SPST Copal_CVS-02xB, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 2x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils.