Labels Milestones
BackID 466, 1.86x2.14mm, 18 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted pin header THT 1x39 1.27mm single row Surface mounted pin header SMD 1x03 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 2x13 2.00mm double row Through hole angled pin header THT 2x24 1.27mm double row Through hole socket strip THT 2x21 2.00mm double row surface-mounted straight pin header, 2x37, 1.00mm pitch, single row Through hole socket strip SMD 2x34 1.00mm double row Through hole socket strip THT 1x33 1.00mm single row Surface mounted pin header THT 2x32 2.54mm double row Through hole socket strip SMD 2x35 1.00mm double row Through hole angled pin header SMD 1x17 2.54mm single row Through hole angled pin header, 1x03, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x34 1.27mm double row Through hole straight Samtec HPM power header series 3.81mm post length THT 1x13 2.54mm single row Through hole angled socket strip, 2x40, 2.54mm.
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