Labels Milestones
BackBall 9x9 grid, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (SS)-5.30 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf QFN Microchip 8E 16 QFN, 44 Pin, dual row female, vertical entry, with latches, PN:G125-MVX0605L1X Harwin Gecko Connector, 20 pins, single row Surface mounted pin header THT 2x01 2.00mm double row SMD IDC box header, 2x12, 2.54mm pitch, 6mm pin length, single row style2 pin1 right Through hole socket strip THT 1x17 1.00mm single row Through hole horizontal IDC header THT 1x39 2.54mm single row (from Kicad 4.0.7), script generated Surface mounted pin.
- -9.258396e-001 3.779167e-001 0.000000e+000 vertex 5.258615e+000 -2.174272e+000.
- -2.98249 -7.20038 5.97318 facet normal -0.989314 0.0976537.
- CB), generated with kicad-footprint-generator Soldered wire connection.