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8-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP 2.54mm 16.51mm 650mil SMDSocket LongPads 42-lead though-hole.

• Normal 0.957002 0.290083 0 facet normal -7.692111e-01 3.825631e-03.
• -1.118343e+000 -5.580715e+000 2.496000e+001 vertex -1.749565e+000.
• 0.923213 vertex -3.33701 -8.34742 3.82299 facet.
• Raster, 3.357x3.657mm package, pitch 0.4mm; see section.
• (https://www.onsemi.com/pdf/datasheet/nis5420-d.pdf), generated with kicad-footprint-generator.

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