Labels Milestones
BackPlastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x22.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 4x-dip-switch SPST KingTek_DSHP04TS, Slide, row spacing 7.62 mm (300 mils 12-lead though-hole mounted DIP package, row spacing 7.62 mm.
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