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HLE-129-02-xxx-DV-BE, 29 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 40 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation AC), generated with kicad-footprint-generator connector Hirose 40pin receptacle vertical Mini USB 2.0 Type B 10103594-0001LF, http://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10103594.pdf USB USB_B USB_micro USB_OTG USB Micro-B, horizontal, https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10104110.pdf USB Micro B USB SMD Micro USB https://gct.co/files/drawings/usb3076.pdf Micro-USB SMD Typ-B Vertical Molex Vertical Micro USB https://gct.co/files/drawings/usb3076.pdf Micro-USB SMD Typ-B Vertical Molex Vertical Micro USB Type B SMT Horizontal 5 Contacts (https://katalog.we-online.de/em/datasheet/65100516121.pdf Mini USB 2.0 Type C Plug Shenzhen Jing Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments DSBGA BGA Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 14x14 grid, 8x8mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf.

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