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Arrasta/arrasta_playbook_v0.9.txt 106 lines REP: repique CAX: caixa MSD: mid surdo (sometimes MS1, MS2, etc, if multiple measures or has planned variations) BSD: back surdo For this tab pidgin, 'l' or 'L' means left hand, 'r' or 'R' means right hand, capital letters mean accents (play much louder). 'B' means Both hands; something repique does occasionally Mid surdos often vary the sticking by personal preference. From cd18ed43dcb6067b24f5a336bfd547b1947b9869 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Add CV in that pauses the clock 3c7abf2196 Go to file d8eca8dc7e Add note resulting from real TL0x4s bugfix/triangle_smoothness Forget (and ignore) fp-info-cache file as it is not possible or desirable to put the notice in a timely manner, at a 10-step panel layout } Experimenting with more panel layout Based on designs from: Skull & Circuits (https://www.skullandcircuits.com/vca-1-2/ - Moritz Klein (https://www.ericasynths.lv/shop/diy-kits-1/edu-diy-vca/) Features: If we expect or plan on developing modules which use the 4 pins RGB RGBLED LED, Round, FlatTop, Rectangular size 5.0x2.0mm^2 z-position of LED center 9.0mm, 2 pins, pitch 5.08mm, size 15.2x11mm^2, drill diamater 1.2mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00012_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix MKDS-1,5-14 pitch 5mm size 80x9mm^2 drill 1.3mm pad 2.6mm terminal block RND 205-00085 pitch 10mm size 92.3x14mm^2 drill 1.15mm pad 3mm Terminal Block WAGO 236-507 45Degree pitch 5mm size 182x14mm^2 drill 1.15mm pad 3mm Terminal Block WAGO 804-106, 45Degree (cable under 45degree), 6 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack No-Lead Package, 9x9mm Body (see Atmel Appnote 8826 64-Lead Plastic Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad with vias HTSSOP, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/40001800C.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 36 Pin (JEDEC MO-153 Var DD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 2.5 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 1mm.

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