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Wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, off-center ball grid, ST die ID 468, 3.15x3.13mm, 49 Ball.

• Normal 0.881936 0.471369 0 facet normal 0.95681 0.29047.
• -1.000000e+00 -8.671859e-14 facet normal -0.0635954 0.807213 0.586824 facet.
• USB SMD USB 2.0 Type.

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