Labels Milestones
BackRaster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments CSD18531Q5A http://www.ti.com/lit/ds/symlink/csd18531q5a.pdf WSON, 6 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AB), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-15A example for new part number: 22-27-2101, 10 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated.
- Vertex -9.355745e+01 9.281117e+01 1.855000e+01.
- S15B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator.