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RGB and Gesture Sensor (https://docs.broadcom.com/doc/AV02-4191EN DFN Sensor optical IR SST LuminOX Luminescence-based O2 sensor, https://sstsensing.com/wp-content/uploads/2021/08/DS0030rev15_LuminOx.pdf Gas Sensor, 6 pin, 2.54mm pitch, double rows Through hole pin header SMD 1x29 1.00mm single row Through hole socket strip THT 2x03 1.27mm double row Through hole socket strip SMD 1x03 2.54mm single row style2 pin1 right Through hole angled pin header, 1x36, 2.54mm pitch, 8.51mm socket length, double rows Surface mounted pin header SMD 1x03 2.00mm single row Through hole straight socket strip, 2x20, 2.00mm pitch, double rows Through hole pin header SMD 2x27 1.27mm double row Through hole pin header SMD 1x20 1.27mm single row Through hole socket strip SMD 2x16 1.00mm double row surface-mounted straight socket strip, 1x38, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 1x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 3x-dip-switch SPST Omron_A6S-310x, Slide, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 4x-dip-switch SPST CTS_Series194-4MSTN, Piano, row spacing 15.24 mm (600 mils), Socket 22-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 42-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 12-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 48-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x27.58mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD DIP Switch SPST Slide 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET SQ MOSFET Infineon DirectFET L6 MOSFET Infineon DirectFET MP MOSFET Infineon DirectFET LA MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET SC MOSFET Infineon DirectFET MZ MOSFET Infineon DirectFET SB MOSFET Infineon DirectFET SA MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET SA MOSFET Infineon DirectFET MD MOSFET Infineon PLCC, 20 pins, dual row male, vertical entry Harwin LTek Connector, 14 pins, single row Through hole IDC header, 2x07, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight socket strip, 2x19, 2.54mm pitch.

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