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Of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.5mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l072kz.pdf WLCSP-49, 7x7 raster, 3.277x3.109mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf Lattice caBGA-381 footprint for ECP5 FPGAs, based on SIP7, http://power.murata.com/data/power/ncl/kdc_nma.pdf Isolated 1W or 2W Single Output SM DC/DC Converters 78sr3.3 78sr5 78sr9 78sr12 78srXX DCDC-Converter, RECOM, RECOM_R5xxxDA, SIP-12, Horizontally Mounted, pitch 2.54mm, size 23.32x6.5mm^2, drill diamater 1.3mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF13 horizontal Hirose FH12, FFC/FPC connector, AFC07-S06FCA-00, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator JST PUD series connector, B12B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-134-02-xxx-DV-BE-LC, 34 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l031f6.pdf WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.5mm UFBGA-64, 8x8 raster, 5x5mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf WLCSP-36, 6x6 raster, 2.61x2.88mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32f042k6.pdf WLCSP-36, 6x6 raster, 2.553x2.579mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l052t8.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row.

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