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B11B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP10: plastic thin shrink small outline package; 24 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils DIL DIP PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 8-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 7x-dip-switch SPST , Piano, row spacing 8.89 mm (350 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 8x-dip-switch SPST Copal_CHS-08B, Slide, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil SMD SMD 4x-dip-switch SPST , Piano, row spacing 10.16 mm (400 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package.

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