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R-XBGA-N6 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YBG pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Surface mounted socket strip THT 2x24 2.54mm double row Through hole straight pin header, 1x15, 2.54mm pitch, single row Through hole straight pin header, 1x35, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x01, 2.54mm pitch, 8.51mm socket length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight socket strip, 2x28, 2.54mm pitch, single row style1 pin1 left Surface mounted socket strip SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip SMD 1x23 2.00mm single row (from Kicad 4.0.7), script generated Through hole angled pin header SMD 2x01 1.27mm double row Through hole angled pin header, 1x39, 2.54mm pitch, 6mm pin length, single row style2 pin1 right Through hole straight pin header, 2x25, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, see http://www.formfactors.org/developer%5Cspecs%5Crev1_2_public.pdf pin header SMD 2x37 1.27mm double row Through hole socket strip THT 2x27 2.54mm double row.

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