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0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Through hole angled pin header, 2x34, 1.00mm pitch, single row Surface mounted socket strip SMD 1x16 2.54mm single row Through hole angled pin header, 2x24, 1.00mm pitch, 2.0mm pin length, double rows Through hole straight socket strip, 2x20, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled socket strip THT 2x01 2.00mm double row Through hole pin header SMD 2x10 2.54mm double row surface-mounted straight socket strip, 2x29, 2.00mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled socket strip, 2x16, 2.54mm pitch, double rows Through hole angled pin header THT 2x31 1.27mm double row Through hole straight socket strip, 2x35, 2.54mm.

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