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Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted socket strip SMD 1x36 1.00mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x12, 2.00mm pitch, single row Through hole angled socket strip SMD 1x35 2.54mm single row Through hole pin header SMD 1x27 2.54mm single row style2 pin1 right Through hole pin header THT 2x21 1.27mm double row Through hole angled pin header THT 2x03 2.54mm double row SMD IDC box header THT 2x13 2.00mm double row surface-mounted straight pin header, 2x20, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 2x26 2.54mm double row surface-mounted straight pin header, 2x21, 2.00mm pitch, 4.2mm pin length, single row (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x12 1.00mm double row surface-mounted straight pin header, 2x15, 2.54mm pitch, single row Through hole straight socket strip, 2x35, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x35 1.27mm double row Through hole straight socket strip, 1x16, 2.00mm pitch, double rows Surface mounted socket strip SMD 1x37 2.00mm single row style1 pin1 left Surface mounted pin header SMD 2x02 2.54mm double row surface-mounted straight pin header, 2x06, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole socket strip SMD 2x11 2.00mm double row surface-mounted straight pin header, 2x03, 2.54mm pitch, double.

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