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Pad HTSSOP32: plastic thin shrink small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN, 4mm x 3mm MLF - 3x3x0.85 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin (https://b2b-api.panasonic.eu/file_stream/pids/fileversion/2787), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System.

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