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8-pin SuperSOT package, http://www.icbank.com/icbank_data/semi_package/ssot8_dim.pdf Power MOSFET package, TDSON-8-1, 5.15x5.9mm (https://www.infineon.com/cms/en/product/packages/PG-TDSON/PG-TDSON-8-1/ TO-50-3 Macro T Package Style M234 Rohm HRP7 SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-7-1/ D2PAK DDPAK TO-263 D2PAK-3 TO-263-3 SOT-404 TO-263 / D2PAK / DDPAK SMD package, http://www.onsemi.com/pub/Collateral/ENA2192-D.PDF Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf USON-10 2.5x1.0mm_ Pitch 0.5mm right angle smd HDMI, Micro, Type D, SMD, 0.4mm pitch, 19 ckt, right angle USB3 type A right angle Molex 0.50mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-3991, 39 Circuits (http://www.molex.com/pdm_docs/sd/5022503991_sd.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 105313-xx02, 2 Pins per row (http://www.molex.com/pdm_docs/sd/431602102_sd.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, LY20-12P-DLT1, 6 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils DIL DIP PDIP 2.54mm 22.86mm 900mil Socket 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket LongPads 64-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 1x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 8-Lead, 300\" Wide, Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-7810745, 7 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator Harwin Female Vertical Surface Mount (SMT), Audio Jack Connector (https://www.cui.com/product/resource/sj-352x-smt-series.pdf 3.5mm audio cui horizontal jack stereo horizontal circular TRS 3.5mm, horizontal, through-hole, https://www.cui.com/product/resource/sj1-353xng.pdf TRS 3.5mm, horizontal, through-hole, https://www.cuidevices.com/product/resource/pdf/sj1-352xn.pdf TRS audio jack stereo horizontal TRS 3.5mm, horizontal, through-hole, https://www.cuidevices.com/product/resource/pdf/sj1-352xn.pdf TRS audio jack stereo horizontal circular TRS 3.5mm, horizontal, through-hole, https://downloads.lumberg.com/datenblaetter/en/1503_07.pdf TRS audio jack stereo horizontal waterproof 6.35mm (1/4 in) Vertical Jack, 3 x 3 mm, 0.5 mm pitch, 20 mm fuse holders; Vertical w/ Stability Pins; 250V; 6.3-16A (http://www.cooperindustries.com/content/dam/public/bussmann/Electronics/Resources/product-datasheets/Bus_Elx_DS_2118_HB_PCB_Series.pdf 5 mm x 20 mm fuse.

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