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= CONN_1; IdModule = Socket_Arduino_Nano:1pin_Nano; EndCmp BeginCmp TimeStamp = /551D94EF; Reference = P6; ValeurCmp = Digital; IdModule = Socket_Arduino_Nano:1pin_Nano; EndCmp BeginCmp TimeStamp = /551D9496; Reference = P3; ValeurCmp = CONN_1; IdModule = Socket_Arduino_Nano:1pin_Nano; EndCmp BeginCmp TimeStamp = /551D9414; Reference = P3; ValeurCmp = CONN_1; IdModule = Socket_Arduino_Nano:Socket_Strip_Arduino_1x15; EndCmp BeginCmp TimeStamp = /551D9496; Reference = P4; ValeurCmp = Analog; IdModule = Socket_Arduino_Nano:1pin_Nano; EndCmp BeginCmp TimeStamp = /551D9466; Reference = P4; ValeurCmp = CONN_1; IdModule = Socket_Arduino_Nano:Socket_Strip_Arduino_1x15; EndCmp BeginCmp TimeStamp = /551D9496; Reference = P2; ValeurCmp = CONN_1; IdModule = Socket_Arduino_Nano:Socket_Strip_Arduino_1x15; EndCmp BeginCmp TimeStamp = /551D9466; Reference = P5; ValeurCmp = CONN_1; IdModule = Socket_Arduino_Nano:1pin_Nano; EndCmp BeginCmp TimeStamp = /551D9414; Reference = P6; ValeurCmp = CONN_1; IdModule = Socket_Arduino_Nano:1pin_Nano; EndCmp BeginCmp TimeStamp = /551D9380; Reference = P2; ValeurCmp = Digital; IdModule = Socket_Arduino_Nano:1pin_Nano; EndCmp BeginCmp TimeStamp = /551D9496; Reference = P4; ValeurCmp = CONN_1; IdModule = Socket_Arduino_Nano:1pin_Nano; EndCmp Hardware/PCB/precadsr/precadsr.kicad_pcb Normal file View File 3D Printing/Cases/Eurorack Modular Case/DSC03765.JPG Executable file Unescape HP = 5.07; // 5.07 for a single 0.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-123-02-xxx-DV-BE-LC, 23 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator Diode SMD 2114 (3652 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py MPS LGA-18 12x12x3.82mm (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MPM3550EGLE/document_id/5102/ Rohm LGA, 10 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001725D.pdf (Page 12)), generated with kicad-footprint-generator Molex LY 20 series connector, 53780-1870 (), generated with kicad-footprint-generator Mounting Hardware, inside through hole Mallory low-profile piezo buzzer, https://www.mspindy.com/specifications/AST1109MLTRQ.pdf Mallory low-profile piezo buzzer, https://mspindy.com/spec-sheets/AST1109MLTRQ.pdf 5.5V, 470mF supercapacitor, 45mohm, -40ºC to +70ºC, https://www.cap-xx.com/wp-content/uploads/datasheets/CAP-XX-DMF470mF-Datasheet.pdf Cliff single 4mm shrouded banana panel socket, through-hole, row spacing 7.62 mm (300 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 10x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row.

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