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32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads.

• 0.840149 0.533176 0.0993614 facet normal 0.989167 0.0992487.
• Vertex 2.928430e+000 -4.890075e+000 2.496000e+001 vertex 2.602059e+000 5.001575e+000.
• -5.00013 4.51216 facet normal.
• Vertex -0.693269 -6.94378 7.20613 facet normal -0.993093 0.0624835.

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