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This release Submitted to fab on 2024/01/24.

Binary files /dev/null and.

• (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf SOIC, 8 Pin (https://www.nxp.com/docs/en/data-sheet/TJA1051.pdf#page=16.
• Raster, 4.039x3.951mm package, pitch 0.4mm; see section.

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