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Wide 16-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 18-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 18-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of MSOP-16 (see https://www.analog.com/media/en/technical-documentation/data-sheets/3748fb.pdf MFSOP 4 pin straight chassis connector Dual front isolated BNC plug (https://www.amphenolrf.com/downloads/dl/file/id/2980/product/644/031_6575_customer_drawing.pdf Dual BNC Horizontal Isolated Subminiature Coaxial Switch 1.35mm High, DC to DC Converters dc-dc recom buck sip-3 pitch 2.54mm 0.167W length 3.6mm diameter 1.6mm Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=7.5mm, , length*diameter=3.8*2.6mm^2, http://www.vishay.com/docs/45231/arseries.pdf C.

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