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Back0.5mm USON-20 2x4mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row (from Kicad 4.0.7), script generated Surface mounted pin header SMD 2x16 1.00mm double row Through hole angled socket strip, 2x35, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole pin header SMD 1x25 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x37 2.54mm single row Through hole Samtec HPM power header series 3.81mm post length, 1x06, 5.08mm pitch, single row (from Kicad 4.0.7!), script generated Through hole angled socket strip, 1x08, 2.54mm pitch, 8.51mm socket length, double rows Through hole angled pin header, 2x05, 2.54mm pitch, DIN 41651 / IEC 60603-13.
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