Labels Milestones
BackWidth 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 16 leads; body width 4.4 mm; thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 122BX.PDF 32-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_10_05-08-1722.pdf DFN, 10 Pin.
- D-Sub connector, horizontal/angled (90 deg), THT-mount, female, pitch.
- Illuminated LED SW PUSH SMALL http://www.ckswitches.com/media/1457/ksa_ksl.pdf.