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Thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x36, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole socket strip THT 2x23 2.54mm double row surface-mounted straight socket strip, 1x29, 2.00mm pitch, 4.2mm pin length, double rows Through hole straight pin header, 1x26, 1.00mm pitch, single row Surface mounted pin header THT 2x39 1.00mm double row Through hole socket strip THT 1x28 1.00mm single row Through hole straight pin header, 1x20, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole socket strip SMD 1x02 2.54mm single row Through hole socket strip SMD 2x19 1.00mm double row surface-mounted straight socket strip, 1x02, 2.00mm pitch, single row Surface.

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