Labels Milestones
Back4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil LongPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations.
- HLE-115-02-xxx-DV-BE, 15 Pins per row, Mounting: PCB Mounting.
- Normal -9.521120e-01 0.000000e+00 -3.057496e-01.
- 7.71007 facet normal -1.284295e-001 -2.247515e-001 9.659154e-001 vertex.