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BackPin (https://www.st.com/resource/en/datasheet/stm32g071k8.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP28: plastic thin shrink small outline package; 10 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf SSOP, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/40001800C.pdf), generated with.
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