Labels Milestones
BackPitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix.
- D="m 2.5787307,3.1496068 h -0.19685" d="M -5.3937043,2.4606366.
- Connector, S10B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated.
- Solder Paste" "Name": "Bottom.