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BackFrame Chip Scale Package - 3x3 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049CH.pdf.
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- Vertical 1-215079-6 8-215079-16 TE-Connectivity Micro-MaTch Vertical 215079-4.
- Skeleton/CE3_Eurorack_box_v105.3mf Executable file View File.
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