Labels Milestones
Back32-Lead Frame Chip Scale Package LFCSP (5mm x 4mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body (see Atmel Appnote 8826 10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 48 pin, exposed pad, thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/ Infineon PG-DSO 12 pin, exposed pad, thermal vias 10-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 6 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of TO-92), also known as TO-226, wide, drill 0.75mm (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 5.08mm, see https://www.centralsemi.com/PDFS/CASE/TO-220-2PD.PDF TO-220-2 Horizontal RM 5.08mm TO-220F-3.
- Without Ground Terminal, without Boss.
- (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD.
- D="m -6.7913422,9.645676 h -0.19685" d="m.
- Size 15.2x10.6mm^2, drill diamater 1.3mm, pad diameter 2.5mm.