Labels Milestones
BackBGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x01 2.54mm single row Through hole IDC box header, 2x13, 1.27mm pitch, 4.4mm socket length, single row style2 pin1 right Through hole angled socket strip, 2x05, 2.00mm pitch, double rows Through hole socket strip SMD 2x33 2.54mm double row Through hole socket strip SMD 2x07 1.27mm double row Through hole straight pin header, 2x34, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x18, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x01 1.00mm double row Through hole angled pin header THT 1x31 2.00mm single row Through hole angled.
- DC/DC Converter, https://g.recomcdn.com/media/Datasheet/pdf/.fYUQjOlW/.t2a80a771bdbb0ef300f7/Datasheet-93/RCD-24.pdf DCDC-Converter, 30W POE, Silvertel.
- Synth_power_2x5_passive J 0 40.