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Http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64, 8x8 raster, 3.623x3.651mm package, pitch 0.65mm UFBGA-32, 6x6, 4x4mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST LFBGA-448, 18.0x18.0mm, 448 Ball, 22x22 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8 1EP ThermalVias WSON, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 1, Wuerth electronics 9774030960 (https://katalog.we-online.de/em/datasheet/9774030960.pdf,), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 10, Wuerth electronics 9774080951 (https://katalog.we-online.de/em/datasheet/9774080951.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5110, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-118-02-xxx-DV-BE-A, 18 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English), generated with kicad-footprint-generator Molex PicoBlade series connector, S2B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator JST XH series connector, LY20-38P-DT1, 19 Circuits (https://www.molex.com/pdm_docs/sd/2005280190_sd.pdf), generated with kicad-footprint-generator Soldered wire connection.

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