3
1
Back

Package, 9x9mm Body (see Atmel Appnote 8826 10-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_10_05-08-1722.pdf DFN, 10 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001725D.pdf (Page 12)), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Broadcom LGA, 8 Pin (JEDEC MO-153 Var FF https://www.jedec.org/document_search?search_api_views_fulltext=MO-153.

New Pull Request