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*~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: unplated through holes: merged pull request 'pcb_finalization' (#1) from bugfix/10hp into main ... Add notes about UX component wiring initial notes for v1 front panel to integer pseudo-origin, remove testing text, decrease title label font so we don't lose it Fix annoyance of 2x05 IDC header THT 2x40 1.27mm double row Through hole.

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