Labels Milestones

Back

DIP-4), row spacing 8.89 mm (350 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil 28-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 22-lead though-hole mounted DIP package, row.

• -9.465500e+01 1.055561e+02 4.255000e+01 facet normal 9.352378e-001 3.366919e-003.
• 55935-0930, 9 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects