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Https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled socket strip SMD 1x39 2.54mm single row style2 pin1 right Through hole angled pin header THT 2x17 2.00mm double row Through hole angled socket strip, 1x31, 1.27mm pitch, double rows Through hole straight Samtec HPM power header series 11.94mm post length, 1x12, 5.08mm pitch, single row Through hole socket strip THT 1x25 2.00mm single row male, vertical entry Harwin LTek Connector, 20 pins, dual row male, vertical entry, PN:G125-FVX1605L0X Harwin Gecko Connector, 34 pins, dual row male, vertical entry, with latches, PN:G125-MVX2605L1X Harwin Gecko Connector, 20 pins, surface mount PLCC, 52 pins, surface mount SMD package Diotec Diotec MicroDil, body 3.0x3.0x1.8mm (e.g. Diode bridge), see http://www.vishay.com/docs/88854/padlayouts.pdf TO-269AA MBS diode bridge Low Profile 8x8mm PQFN, Dual Cool 88, https://www.onsemi.com/pub/Collateral/FDMT80080DC-D.pdf.

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