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20-Pin Thermally Enhanced Thin Shrink Small Outline (ST)-4.4 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x32.66mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 1x-dip-switch SPST Copal_CHS-01A, Slide, row.

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