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USB-B receptacle horizontal through-hole GCT USB1046, USB Type C, vertical, SMT, https://datasheet.lcsc.com/lcsc/2108072030_G-Switch-GT-USB-7051A_C2843970.pdf USB C Type-C USB3 receptacle SMD USB Micro-B receptacle, through-hole, vertical, http://katalog.we-online.de/em/datasheet/614105150721.pdf usb micro receptacle vertical Hirose DF11 through hole, vertical, https://www.tme.eu/Document/2d152ced3b7a446066e6c419d84bb460/XT60%20SPEC.pdf M8 Male connector for 1.6mm PCB's with 08 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 05 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 05 contacts (polarized Highspeed card edge connector for PCB's with 70 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 20 contacts (polarized Highspeed card edge connector for PCB's with 05 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 05 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 60 contacts (not polarized Highspeed card edge card connector socket for 2.36mm PCBs, vertical, alignment pins, weld tabs (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm Highspeed card edge connector for IQRF TR-x2D(C)(T) modules, http://iqrf.org/weben/downloads.php?id=104 8 pin DIP socket A-001 1 14 pin DIP socket A-004 4 Knobs Screws, nuts, and spacers (see build notes) 1 SIP socket, 2.54 mm, 1x4 Pin header, 2.54 mm, 1x2 (see [build notes](build.md)) | | | | J5, J12, J13 | 3 | A1M | **Potentiometer, 9 mm vertical pots. You can http://mozilla.org/MPL/2.0/. If it is based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f100v8.pdf TFBGA-100, 10x10 raster, 8x8mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 483, 3.73x4.15mm, 115 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, https://www.diodes.com/assets/Datasheets/AP22913.pdf WLCSP-4, 0.64x0.64mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, https://www.diodes.com/assets/Datasheets/AP22913.pdf WLCSP-4, 0.64x0.64mm, 4 Ball, 2x2 Layout, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 ST 20-Lead Plastic Quad Flat, No Lead Package (MR) - 9x9x0.9 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing.

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