Labels Milestones
Back42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID.
- And 13 removed for voltage.
- 0.8 CS325 CSG235 Spartan-7 BGA.
- MC-156 https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-156_en.pdf, 7.1x2.5mm^2 package SMD SMT SPST EVQP2.
- (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP.