synth_tools

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Body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf SSOP 3.9 4.9 1.00 SSOP14: plastic shrink small outline package; 24 leads; body width 4.4 mm; thermal pad TSSOP HTSSOP 0.65 thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Shrink Small Outline http://www.vishay.com/docs/49633/sg2098.pdf SOP, 16 Pin (https://www.diodes.com/assets/Datasheets/PI6C5946002.pdf#page=12), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-14DS-0.5V, 14 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Surface mounted pin header THT 2x18 1.27mm double row Through hole socket strip SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip SMD 1x22 2.00mm single row Through hole socket strip SMD 1x06 1.00mm single row Through hole straight socket strip, 2x09, 1.00mm pitch, single row Through hole angled pin header THT 2x30 1.27mm double row Through hole socket strip THT 1x12 2.54mm single row style1 pin1 left Surface mounted pin header SMD 1x33 2.00mm single row Surface mounted pin header THT 2x29 1.27mm double row Through hole angled socket strip, 2x36, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 2x14 2.00mm double row surface-mounted straight socket strip, 1x17, 1.27mm pitch, single row Through hole socket strip SMD 1x33 2.54mm single row Through hole vertical IDC box header THT 2x36 1.00mm double row Through hole angled socket strip, 2x02, 1.00mm pitch, double rows Through hole angled pin header, 1x09, 2.00mm pitch, 6.35mm socket length, single row style2 pin1 right Through hole IDC header, 2x20, 2.54mm pitch, 8.51mm socket length, double rows Surface mounted socket strip SMD 1x02 2.54mm single row male, vertical entry, PN:G125-FVX2005L0X Harwin Gecko Connector, 50 pins, dual.

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