3
1
Back

6.1 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic Dual Flat, No Lead Package - 4.0x4.0x0.8 mm Body [QFN] (see datasheet at http://www.cypress.com/file/138911/download and app note at http://www.cypress.com/file/140006/download DFN, 6 Pin (https://docs.broadcom.com/docs/AV02-4755EN), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector.

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