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8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor 506BU.PDF 8-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic QFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3471fb.pdf#page=15), generated with kicad-footprint-generator ipc_gullwing_generator.py PQFP, 32 Pin (http://infocenter.nordicsemi.com/pdf/nRF52810_PS_v1.1.pdf#page=468), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MC_1,5/11-GF-5.08; number of pins: 09; pin pitch: 3.81mm; Angled || order number: 1827949 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/15-GF-3.81; number of pins: 14; pin pitch: 3.81mm; Vertical; threaded flange || order number: 1757307 12A || order number: 1829154 12A 630V Generic Phoenix Contact connector footprint for: GMSTBVA_2,5/12-G-7,62; number of pins: 03; pin.

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