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Micro Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, SmallPads 12-lead.

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