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SLF6025, 6.0mmx6.0mm (Script generated with kicad-footprint-generator ipc_noLead_generator.py 44-Lead Plastic Quad Flat, No Lead Package - 4x4x0.9 mm Body [QFN] with thermal pad TSSOP HTSSOP 0.65 thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 932AZ.PDF TQFP128 14x14 / TQFP120 CASE 932AZ (see ON Semiconductor 122BX.PDF 32-Lead Plastic DFN (2mm x 2mm) 0.40mm pitch DDB Package; 8-Lead Plastic PSOP, Exposed Die Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-32/ Infineon SO package 20pin without exposed pad TSSOP, 14 Pin (https://www.st.com/resource/en/datasheet/l6491.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 5273-03A example for new.

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