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UBGA U169 BGA-169 BGA-200, 14.5x10.0mm, 200 Ball, 12x22 Layout, 0.8x0.65mm Pitch.

• 20:19:51 2024 Copper Layer Stackup: T5 15.200mm.
• -0.491602 0.262766 0.83023 facet normal 0.631369 0.769324.
• 0.629653 0.76827 0.115322 facet normal 1.950737e-01 9.807885e-01.
• 2x27 1.27mm double row Through hole IDC header.
• And 3 https://www.youtube.com/watch?v=xSXH0wFprbY is.

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