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Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, YBJ0008.

• 5.54328 -2.2961 6.59 facet.
• 2.856205e-001 4.974155e-001 8.191451e-001 vertex -5.126583e+000 -3.044064e+000.
• 8.72838 0.0386444 facet normal -0.30557 0.114495 0.945261.

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