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2x32 1.27mm double row surface-mounted straight pin header, 2x18, 2.00mm pitch, 6.35mm socket length, single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole pin header THT 1x40 2.54mm single row Through hole angled pin header, 2x03, 2.54mm pitch, 6mm pin length, double rows Surface mounted pin header THT 2x10 1.27mm double row Through hole straight pin header, 2x27, 1.00mm pitch, double rows Surface mounted pin header THT 1x05 2.54mm single row Surface mounted socket strip THT 1x40 1.27mm single row style1 pin1 left Surface mounted socket strip THT 2x01 2.00mm double row Through hole angled pin header, 2x33, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x28 2.54mm single row Through hole socket strip THT 2x30 2.54mm double row surface-mounted straight socket strip, 2x15, 2.00mm pitch, 6.35mm socket length, double rows Through hole pin header THT 1x36 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 1x27 2.00mm single row Through hole angled pin header, 1x28, 1.27mm pitch, double rows Through hole angled pin header SMD 1x03 2.00mm single row Through hole pin header SMD 1x31 1.00mm single row Through hole straight pin header, 1x31, 1.27mm pitch, double rows Through hole pin header THT 1x23 1.27mm single row Through hole IDC box header, 2x04, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole Samtec HPM power header series 3.81mm post length, 1x15, 5.08mm pitch, single row Through hole Samtec HPM power header series 3.81mm post length, 1x18, 5.08mm pitch, see http://www.vishay.com/docs/88656/kbu4.pdf Vishay KBU rectifier package, 3.95mm pitch (http://www.farnell.com/datasheets/2238158.pdf, http://www.cdil.com/s/kbp2005_.pdf Vishay KBM rectifier diode bridge SMD diode bridge ABS (Diotec), see https://diotec.com/tl_files/diotec/files/pdf/datasheets/abs2.pdf SMD package Diotec Diotec MicroDil, body 3.0x3.0x1.8mm (e.g. Diode bridge), see http://www.vishay.com/docs/88854/padlayouts.pdf SMD diode bridge Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, https://www.diodes.com/assets/Datasheets/AP22913.pdf WLCSP-4, 0.64x0.64mm, 4 Ball, 2x2 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 1156 1.

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