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ID 466, 1.86x2.14mm, 18 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole angled socket strip, 2x04, 2.00mm pitch, 6.35mm socket length, single row Surface mounted pin header THT 2x13 2.54mm double row Through hole straight pin header, 2x24, 1.00mm pitch, 2.0mm pin length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled pin header THT 2x14 1.27mm double row Through hole straight pin header, 2x34, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole Samtec HPM power header series 11.94mm post length THT 1x13 2.54mm single row Through hole straight pin header, 2x33, 2.00mm pitch, double rows Through hole pin header THT 1x40 1.27mm single row Surface mounted pin header SMD 1x18 2.54mm single row style2 pin1 right Through hole angled socket strip SMD 2x19 1.27mm double row Through hole straight socket strip, 2x35, 1.27mm pitch, 4.0mm pin length, double rows Through hole straight socket strip, 1x10, 2.00mm pitch, 4.2mm pin length, single row Through hole angled socket strip, 1x39, 2.00mm pitch, 4.2mm pin length.

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