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SOIC 2.54 8-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 8x-dip-switch SPST Copal_CHS-08A, Slide, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 4x-dip-switch SPST KingTek_DSHP04TJ, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, based on the thru-holes. C7 is a cylinder with 3 positions D Switch, single pole normally-open tactile switch SPST angled PTS645VL83-2 LFS C&K Button tactile switch SPST angled PTS645VL58-2 LFS C&K Button SW PUSH SMALL http://www.ckswitches.com/media/1457/ksa_ksl.pdf SW PUSH SMALL Tactile C&K Generic Buzzer, D15mm height 7.5mm with RM7.6mm Generic Buzzer, D12mm height 9.5mm with RM7.6mm Generic Buzzer, D15mm height 7.5mm with RM7.6mm Generic Buzzer, D14mm height 7mm Non-Polar Electrolytic Capacitor CP, Radial series, Radial, pin pitch=10.00mm, , diameter=30mm, Electrolytic Capacitor, , http://www.vishay.com/docs/42037/53d.pdf CP Axial series Axial Horizontal pin pitch 10.00mm diameter 10.5mm width 5.0mm Capacitor C, Rect series, Radial, pin pitch=1.50mm, diameter=4mm, height=5mm, Non-Polar Electrolytic Capacitor CP Radial series Radial pin pitch 6.35*15.24mm^2 length 19.304mm width 10.795mm Bourns 8100 3 Phase, CM Choke, https://vacuumschmelze.com/03_Documents/Datasheets%20-%20Drawings/Commom-Mode-Chokes/6123-X140.pdf 3 Phase, CM Choke, https://vacuumschmelze.com/03_Documents/Datasheets%20-%20Drawings/Commom-Mode-Chokes/6123-X240.pdf Wuerth, WE-CMB, Bauform XL, Wuerth, WE-CMB, Bauform M, Wuerth, WE-CMB, Bauform XL.

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