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CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wl54jc.pdf ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stulpi01a.pdf TFBGA-64, 8x8 raster, 3.347x3.585mm package, pitch 0.4mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.5mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-49, 7x7 raster, 3.277x3.109mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 7.62 mm (300 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 7x-dip-switch SPST KingTek_DSHP07TJ, Slide, row spacing 11.48 mm (451 mils 18-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 40-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads THT DIP DIL ZIF 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 8x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 32-pin zero insertion force socket, through-hole, row spacing 11.48 mm (451 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 12x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket LongPads 22-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 4x-dip-switch SPST Copal_CHS-04B, Slide, row spacing 8.89 mm (350 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile.

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